Trace:
Differences
This shows you the differences between two versions of the page.
| Both sides previous revision Previous revision | Next revision Both sides next revision | ||
|
en:sle-bs21 [2024/04/08 05:33] aithinker_fae |
en:sle-bs21 [2024/04/09 03:40] aithinker_fae |
||
|---|---|---|---|
| Line 1: | Line 1: | ||
| - | ====== Ai-BS21系列专题模组 ====== | + | ====== Ai-BS21 Series Module ====== |
| ---- | ---- | ||
| + | ====== 1. Overview === | ||
| - | <WRAP center round tip 50%>**全系列模组购买请戳：**[[http://shop.ai-thinker.com|安信可官方淘宝店]]</WRAP> | + | **Ai-BS21-32S** is a Bluetooth NearLink module developed by Shenzhen Ai-Thinker Technology Co., Ltd. The module's core processor chip BS21Q321 (QFN48P) is a highly integrated 2.4GHz SoC BLE&SLE chip that supports BLE5.4/SLE1.0 and integrates RF circuits. RF includes power amplifier PA, low noise amplifier, TX/RX Switch, integrated Power management and other modules support 3 bandwidths of 1M/2M/4M, with a maximum rate of 12Mbit/s. |
| - | ====== 一、概述 === | + | The chip integrates a high-performance 32bit microprocessor (MCU), hardware security engine and rich peripheral interfaces, including SPI, UART, I2C, PMW, GPIO, USB2.0, NFC Tag, PDM, I2S/PCM, QDEC , KEYSCAN keyboard scanning circuit. Supports 8-channel 13bit resolution ADC, ADC supports docking audio AMIC, built-in SRAM and sealed Flash, and supports running programs on Flash. Supports LiteOS and provides an open and easy-to-use development and debugging environment. It is suitable for PC accessories, IoT and other Internet of Things intelligent terminal fields. |
| - | **Ai-BS21-32S**是由深圳市安信可科技有限公司开发的蓝牙星闪模块。该模块核心处理器芯片BS21Q321(QFN48P)是一款高集成2.4GHz SoC BLE&SLE芯片，支持BLE5.4/SLE1.0，集成RF电路，RF包含功率放大器PA、低噪声放大器、TX/RX Switch、集成电源管理等模块，支持1M/2M/4M 3种带宽，最大支持12Mbit/s速率。 | + | **Application Scenario** |
| - | 芯片集成高性能32bit微处理器(MCU)，硬件安全引擎以及丰富的外设接口，外设接口包含SPI、UART、I2C、PMW、GPIO、USB2.0、NFC Tag、PDM、I2S/PCM、QDEC、KEYSCAN键盘扫描电路，支持8路13bit分辨率ADC，ADC支持对接音频AMIC，内置SRAM和合封Flash,并支持在Flash上运行程序。支持LiteOS，并配套提供开放、易用的开发和调试运行环境。适应于PC配件，IoT等物联网智能终端领域。 | + | * Lower energy consumption (only 60% of Bluetooth); low-power application scenarios: battery-powered devices --- not implemented |
| + | * Faster speed (more than 6 times that of Bluetooth); high-speed application scenarios: high-quality audio headsets, speakers, printers --- not implemented | ||
| + | * Lower latency (only 1/30 of Bluetooth); game console, mouse——not implemented | ||
| + | * More stable connection (anti-interference sensitivity is 7dB higher than Bluetooth)————Achieved | ||
| + | * Wider coverage (more than 2 times higher than Bluetooth)————not implemented | ||
| + | * Larger network (more than 10 times compared to Bluetooth). Multi-device networking scenario————not implemented | ||
| - | **应用场景** | + | **Selection table ** |
| - | + | * {{ ::ai-bs21选型表.xlsx |selection table}} | |
| - | * 更低能耗（仅为蓝牙60%）；低功耗应用场景：电池供电设备————未实现 | + | |
| - | * 更快速度（蓝牙的6倍以上）；高速率应用场景：高音质音频耳机，音箱，打印机————未实现 | + | |
| - | * 更低时延（仅为蓝牙的1/30）；游戏机，鼠标————未实现 | + | |
| - | * 更稳连接（抗干扰灵敏度相比蓝牙提升7dB）————已实现 | + | |
| - | * 更广覆盖（相比蓝牙提升2倍以上）————未实现 | + | |
| - | * 更大组网（相比蓝牙10倍以上)。多设备组网场景————未实现 | + | |
| - | + | ||
| - | **选型表 ** | + | |
| - | * {{ ::ai-bs21选型表.xlsx |选型表}} | + | |
| --------- | --------- | ||
| Line 28: | Line 25: | ||
| - | =====模组特点===== | + | =====Module Features===== |
| - | * 支持BLE和SLE双模共存 | + | * Supports BLE and SLE dual-mode coexistence |
| - | * 支持BLE5.4 | + | * Support BLE5.4 |
| - | * 支持LE 1M，LE 2M，Long Range | + | * Support LE 1M, LE 2M, Long Range |
| - | * RISC-V高性能32bit CPU，最大主频支持64MHz，支持浮点，支持SWD | + | * RISC-V high-performance 32bit CPU, maximum frequency supports 64MHz, supports floating point, supports SWD |
| - | * 支持SRAM 160KB，内置512KB Flash | + | * Support SRAM 160KB, built-in 512KB Flash |
| - | * 支持的加密方式：AES（ Advanced Encryption Standard）、 SM4 和 TRNG（True Random Number Generator） | + | * Supported encryption methods: AES：AES（ Advanced Encryption Standard）、 SM4 and TRNG（True Random Number Generator） |
| - | * 支持的外设接口包含：SPI、UART、I2C、PMW、GPIO、USB2.0、NFC Tag、PDM、I2S/PCM、QDEC、KEYSCAN等 | + | * Supported peripheral interfaces include：SPI、UART、I2C、PMW、GPIO、USB2.0、NFC Tag、PDM、I2S/PCM、QDEC、KEYSCAN, etc. |
| - | * 支持BLE白名单，可解析 | + | * Supports BLE whitelist and can be parsed |
| - | * 支持HID人机接口设备 | + | * Support HID human-machine interface device |
| - | * 支持BLE业务间隙扫频功能 | + | * Supports BLE service gap frequency sweep function |
| - | * 支持BLEAFH调频 | + | * Support BLEAFH frequency modulation |
| - | * 支持SLE1.0协议，无线帧类型 1(GFSK帧)和无线帧类型 2(低时延帧)，G帧和T帧，广播、发现和接入功能，单播功能，组播功能，高精度测距 | + | * Support SLE1.0 protocol, wireless frame type 1 (GFSK frame) and wireless frame type 2 (low delay frame), G frame and T frame, broadcast, discovery and access functions, unicast function, multicast function, high Accurate ranging |
| - | * 支持B/SLE和WLAN，3/4 线片外共存(实时性高) | + | * Support B/SLE and WLAN, 3/4 lines off-chip coexistence (high real-time performance) |
| - | * 支持B/SLE和WLAN，通过UART共存(实时性低) | + | * Support B/SLE and WLAN, coexist through UART (low real-time performance) |
| - | ====== 二、模组&开发板 === | + | ====== 2. Modules & Development Boards === |
| - | ===== 2.1 模组规格书 ===== | + | ===== 2.1 Module specifications ===== |
| - | Ai-BS21-32S 模组规格书：{{ ::ai-bs21-32s_v1.0.0_规格书-20240305.pdf |中文}} {{ ::ai-bs21-32s_v1.0.0_specification-20240305.pdf |EN}} | + | Ai-BS21-32S：{{ ::ai-bs21-32s_v1.0.0_规格书-20240305.pdf |CN}} {{ ::ai-bs21-32s_v1.0.0_specification-20240305.pdf |EN}} |
| - | ===== 2.2 开发板规格书 ===== | + | ===== 2.2 Development board specifications ===== |
| - | Ai-BS21-32S-Kit开发板规格书：{{ ::ai-bs21-32s-kit_v1.0.0_规格书-20240322.pdf |中文}} {{ ::ai-bs21-32s-kit_v1.0.0_specification-20240325.pdf |EN}} | + | Ai-BS21-32S-Kit：{{ ::ai-bs21-32s-kit_v1.0.0_规格书-20240322.pdf |CN}} {{ ::ai-bs21-32s-kit_v1.0.0_specification-20240325.pdf |EN}} |
| - | ===== 2.3 开发板原理图 ===== | + | ===== 2.3 Development board schematic diagram ===== |
| - | Ai-BS21-32S-Kit开发板原理图：{{ ::21051160_ai-bs21-32s-kit_v1.0_原理图-20240218.pdf |点击查看}} | + | Ai-BS21-32S-Kit：{{ ::21051160_ai-bs21-32s-kit_v1.0_原理图-20240218.pdf |Click to view}} |
| - | ===== 2.4 模组推荐封装 ===== | + | ===== 2.4 Module recommended package ===== |
| - | Ai-BS21-32S模组推荐封装：{{ :ai-bs21-32s_packaging.zip |点击下载}} | + | Ai-BS21-32S：{{ :ai-bs21-32s_packaging.zip |Click to view}} |
| - | ====== 三、开发工具及资料 === | + | ====== 3. Development tools and materials === |
| - | ===== 3.1 应用资料 ===== | + | ===== 3.1 application materials ===== |
| - | 1. BS21-Combo-AT指令集：{{ ::bs21_模组combo通用指令_v4.18p_0.0.1.pdf |点击查看}} | + | 1. BS21-Combo-AT command set：{{ ::bs21_模组combo通用指令_v4.18p_0.0.1.pdf |Click to view}} |
| - | 2.出厂固件：固件号2530 {{ ::2530_bs21_comboat_v0.0.6_sle.zip |点击下载}} | + | 2. Factory firmware： firmware No.:2530 {{ ::2530_bs21_comboat_v0.0.6_sle.zip |Click to download}} |
| - | ===== 3.2 开发工具 ===== | + | ===== 3.2 development tools ===== |
| - | 1. 星闪系列模组烧录工具：{{ ::burntool.zip |点击下载}} | + | 1. NearLink series module burning tool：{{ ::burntool.zip |点击下载}} |
| - | ===== 3.3 应用博文 ===== | + | ===== 3.3 Application blog ===== |
| - | 1. 星闪ComboAT透传使用:[[https://blog.csdn.net/Boantong_/article/details/137037955|【遥遥领先】星闪专属ComboAT初体验，点对点连接实现透传，强抗干扰、超低延迟、超远通讯]] | + | 1. NearLink ComboAT Use transparent transmission:[[https://blog.csdn.net/Boantong_/article/details/137037955|[Far Ahead] First experience of NearLink’s exclusive ComboAT, point-to-point connection to achieve transparent transmission, strong anti-interference, ultra-low latency, ultra-long distance communication]] |