The ESP32-S3 series module (a description module below) is a Wi-Fi + BLE module developed by Shenzhen Ai-Thinker Technology Co., Ltd. Module core processor chip ESP32-S3 is a low-powerful low power consumption Wi-Fi and Bluetooth System-level chip (SOC), designed for Internet access (IoT), mobile devices, wearable electronic devices, smart home, etc.

ESP32-S3 chip has industry-leading low power performance and RF performance, Support WiFi IEEE802.11b/g/n protocol and Bluetooth 5.0. The chip is powered by Xtensa-R 32-bit LX7 dual-core processor and operates at up to 240 MHz. Support secondary development without the use of other microcontrollers or processors. The chip has built-in 512 KB SRAM, 384 KB ROM, 16KB RTC SRAM.

The chip supports a variety of low-power working states and can meet the power requirements of various application scenarios. The precise clock gating function, dynamic voltage clock frequency regulation function and RF output power adjustment function of the chip can achieve the best balance between communication distance, communication rate and power consumption.

ESP-S3-12K：Chinese EN

ESP-S3-32S：Chinese EN

ESP-S3-12K Schematic： Click to download

ESP-S3-32S Schematic： Click to download

ESP-S3-12K-Kit :Chinese English

ESP-S3-32S-Kit：Chinese English

ESP-S3-12K-Kit Schematic：Click to download

ESP-S3-32S-Kit Schematic：Click to download

ESP-S3-12K Technical Reference Manual：Click to view

ESP32S3 Chip technology Specification：Chinese

ESP-S3-12K Technical Reference Manual：Click to view

ESP32S3 Chip technology Specification：Click to view

PCB schematic package download link (extraction code: sgaw) : Network disk link